The Matrix stripper is a plasma system used for ashing of photoresist. In plasma ashing, a radio frequency (RF) electric field breaks down the non-reactive gaseous O2 molecules into a plasma of reactive mono-atomic oxygen radicals. The highly reactive radicals react with the organic polymers in the photoresist to form gaseous products (CO, CO2, gaseous H2O, etc.) that are pumped away.
PROCEDURE:
SYSTEM WILL ONLY ASH THE SIDE OF THE WAFER THAT IS UP.
1. If in STANDBY MODE, press the EXIT button. The MAIN MENU will appear.
NOTE: System should already be ON and in the STANDBY MODE.
2. Press the LOAD button; load a recipe by inserting the appropriate process card; follow instructions on the screen. Each process card contains two recipes, each coded to a specific end of the card.
3. To view or edit the recipe parameters, press the EDIT button, and then the EXIT button when done editing. DO NOT SAVE EDITED RECIPE TO PROCESS CARD.
4. Load the cassette from the bottom (slot 1) with wafers placed process-side-up.
DO NOT USE THE 2" WAFER CARRIER IF AN ADJACENT CASSETTE SLOT HOLDS A 3" WAFER.
5. Press the RUN button. The RUN OPTION screen will appear. Press the HOME button to move the cassette to wafer slot 1.
6. To start processing, press AUTO button for multiple wafers or SINGLE button for a single wafer.
7. When processing is finished, the RUN OPTIONS screen will appear. Press the EXIT button to return to the MAIN MENU.
8. Press the STANDBY button in the right corner of MAIN MENU screen. In this mode, the chamber door closes and the chamber is put under vacuum so that no backfill or moisture enters the system. (RF power and O2 flow are OFF.)
9. Remove wafers from the cassette.
SAMPLE PROCESS CARD RECIPES
CARD LABELLED "DESCUM/STANDARD" DESCUM PROCESS Pressure: 1.75 Torr MFC 1 : 0 % MFC 2 : 66 % MFC 3 : 0 % RF FWD : 100 Watts EP Mode : (0) Timed = 0 min. 40 seconds Filter : 2 STANDARD PROCESS Pressure: 5.00 Torr MFC 1 : 55 % MFC 2 : 0 % MFC 3 : 0 % RF FWD : 500 Watts EP Mode : (2) Absolute = Percent : 40 Overetch: 0 min. 20 seconds Cutoff : 1 min. 20 seconds Holdoff : 10 seconds Filter : 2 CARD LABELLED "STRIP/EZDESUM" STRIP PROCESS Pressure: 5.00 Torr MFC 1 : 55 % MFC 2 : 0 % MFC 3 : 0 % RF FWD : 500 Watts EP Mode : (0) Timed = 3 min. 0 seconds Filter : 2 EZDESCUM PROCESS Pressure: 1.75 Torr MFC 1 : 0 % MFC 2 : 66 % MFC 3 : 0 % RF FWD : 50 Watts EP Mode : (0) Timed = 5 min. 0 seconds Filter : 2