CHA MARK 40 EVAPORATOR
- CHAMBER PREPARATION
- Auto-Tech II panel:
AUTO CONTROL SWITCH should be at START (pumped-down).
AUTO CONTROL SWITCH to STANDBY.
Wait until you hear Hi-Vac valve open.
AUTO CONTROL SWITCH to VENT position.
After vent, AUTO CONTROL SWITCH to STANDBY.
- Open chamber door.
- Shutter Control Panel: SHUTTER 2 to OPEN.
- E.B. Gun Rotation Control Panel: Load/check crucible source materials with SOURCE SELECTOR ROCKER SWITCH to MANUAL and SOURCE SELECTOR ROTARY SWITCH to CRUCIBLE NUMBER. Refer to documentation on side of control panel cabinet for crucible, film, and process data. Record crucible changes on the paper affixed to the side of the control panel cabinet.
- Shutter Control Panel: SHUTTER 2 to AUTO.
- Sycon Rate Controller: Check crystal. Useful service is from 100% to 30%.
- Load sample.
- Close chamber door.
- Auto-Tech II panel: AUTO CONTROL SWITCH to START (there is a 20 second delay).
- Vacuum Gauge Controller:
| Pressure Gauges |
| A |
Rough Pressure |
| B |
Chamber Pressure |
| IG1 |
System Pressure |
| IG2 |
Chamber Pressure |
IG2 must be on in order for source power to be turned on.
Pump down to at least 2 x 10-6 before starting a deposition.
| Example Sycon Process |
| STEP # |
MODE |
FILM # |
THICKNESS(kÅ) |
| 1 |
AUTO |
1 |
0.100 |
| 2 |
AUTO |
2 |
0.300 |
| 3 |
AUTO |
3 |
2.500 |
| 4 |
END |
|
|
| Edit password = 0200 |
- CONTROL SETUPS
- Sycon Rate Controller:
Sycon status Stopped...
Press MENU.
Press 3 (Review Process).
Press MENU.
Press 1-8 (desired process #).
Edit process with keypad.
After editing process press MENU twice.
- Shutter Control Panel: All shutters to AUTO position.
- Fixture Control Panel: Turn the on/off switch to the ON position (if you want rotation). Turn the knob to the FWD or REV position. Choose speed of rotation with the SPEED knob. BRAKE stops the rotation.
- E.B. Gun Rotation Control Panel: Select desired process with PROCESS SELECTOR SWITCH (1-8). Select the SOURCE SELECTOR SWITCH to AUTO. If using the Thermal sources, select it to the AUTO position.
- DEPOSITION
- GUN CONTROL 1 panel: E-beam = Emission Current. Thermal = Filament Current.
- HIGH VOLTAGE panel: Keyswitch ON.
- GUN CONTROL 1 panel: Switch ON.
- Sycon Rate Controller: Press the START button. Press the 4 button.
- Each process step will go through XTAL VFY, FILM HOLD, RISE 1, SOAK 1, RISE 2, SOAK 2, DEPOSIT, and IDLE RAMP.
- Beam Sweep Control 1 Panel: During SOAK 1, adjust the beam position and movement.
- The gun control sometimes loses power when the crucible turret rotates. Correct at the GUN CONTROL 1 panel by moving the switch to ON.
- If a problem arises, press STOP on the Sycon and turn off the High Voltage key
- Never leave the machine unattended during a process run
- Enter run in logbook
- Upon completion of process, Sycon indicates STOPPED REMOTE.
- Gun Control Gun 1 Panel: switch OFF.
- High Voltage Panel: keyswitch OFF.
- CHAMBER VENTING
- Wait at least 10 minutes before venting.
- Auto-Tech II panel:
AUTO CONTROL SWITCH to STANDBY.
Wait until you hear the Hi-Vac valve close.
AUTO CONTROL SWITCH to VENT.
After vent, AUTO CONTROL SWITCH to STANDBY.
Open chamber door.
Remove sample.
Close chamber door.
AUTO CONTROL SWITCH to START position (there is a 20 second delay).