Photoresist

Bakes are on hotplate except as otherwise noted.

Photoresist

-

Coating

Type

Spin
rpm/sec

Pre Bake
Co/sec

Exposure
Machine/sec.
average

Post Bake
Co/sec

Developer/sec

Arch OiR

906-10

?

?

?

?

?

?

Arch OiR
908-20HC

Positive

3500/60

90/60

Stepper/3
Contact/?

120/60

OPD4262/60

Arch OiR
908-35

Positive

3500/60

90/120

Stepper/?
Contact/?

120/120

OPD4262/90

Arch OiR
BPRS200

Positive
Lift Off

5000/60

105/30
minute
oven

Stepper/2.5-3.0
Contact/6-8

-No PEB-

Optional
115/30
minute
oven hardbake

PLSI 3:1/90

Olin OiR
897-12MK

Positive

3500/60

90/60

Stepper/4
Contact/10

120/60

OPD4262/60

Olin OiR
897-21MK

Positive

3500/60

90/60

Stepper/8
Contact/20

120/60

OPD4262/60

Futurrex
NR8-1500

Negative

4000/60

120/60

Stepper/8
Contact/20

none

RD2/120

Futurrex
NR8-3000

Negative

4000/60

120/60

Stepper/16
Contact/40

none

RD2/120

Futurrex
NR7-1500PY

Negative

4000/60

120/60

Stepper/6
Contact/20

120/60

RD6/10-15

Futurrex
NR7-3000PY

Negative

?

?

Stepper/?
Contact/?

?

RD6

Futurrex

NR5-8000

?

?

?

?

?

?

Futurrex

RR2

NR7

Photoresist

Remover

Remove/Liftoff photoresist 110oC RR2 for 5-10 minutes.

Shipley

FSC-M

Protective

Coating

3000/60

120/120

None

None

None

MicroSi

HMDS

Adhesion

Promoter

120oC oven dehydrate wafer >=30 min. --- Spin 2 krpm/60 sec.